Dr. Chen joined the Department of Mechanical Engineering in November 2002. Prior to that, he was a post-doctoral researcher at the Computational Mechanics Center at the University of Wisconsin, Madison. His research interests are in the areas of thermomechanical reliability of electronic packaging, microfluidics, and stability and resilience of socio-ecological systems. His hometown is Taipei, Taiwan, where he finished his education through the M.S. degree.
ME 631 - Advanced Mechanics of Materials (04S, 07S, 08F)
ME 493/693 - Introductions to Microfluidics (08S)
ME 409 - Controls (09S)
Class access and course materials are available at UAF Blackboard.
Education:
Ph.D. in Mechanical Engineering, University of Wisconsin, Madison, 2000
M. S. in Mechanical Engineering, National Taiwan University, Taipei, 1990
B. S. in Mechanical Engineering, National Taiwan University, Taipei, 1988
Research Projects:
Enhanced thermal reliability of electronic packaging by optimizing underfill material properties
Drop impact dynamics of stacked chip scale packaging
Droplet-based microdialysis
Hierarchical, agent-coupled state modeling of socio-ecological systems
Selected Publications:
C.-f. Chen, “A quick comment on ‘Effects of disturbed flow on endothelial cells’,” Ann. Biomed. Eng, in review, 2008.
C.-f. Chen, “A batch process for collision detection of moving convex polygons,” ASME J. Computing and Information Science in Engineering, in review, 2008.
C.-f. Chen and D. Peterson, “Board-level drop impact dynamics of stacked CSP module – an Elastic Analysis, “IEEE Trans. Components and Packaging Technologies, in review, 2008.
D. Peterson and C.-f. Chen, “Board-level drop impact response of lead-free stacked CSPs by finite element analysis,” IEEE Trans. Advanced Packaging, in review, 2008.
C.-f. Chen and K. L. Drew, “Droplet-based microdialysis –concept, theory, and design consideration,” in press, J. Chromatogr. A., 2008. doi:10.1016/j.chroma.2008.09.006.
C.-f. Chen and P. C. Karulkar, “Dependence of flip chip solder reliability on filler settling,” IEEE Trans. Advanced Packaging, accepted, 2008.
C.-f. Chen, “Effect of underfill filler settling on thermomechanical fatigue analysis of flip-chip eutectic solders,” Microelectronics Reliability, 48, pp. 1040-1051, 2008. doi:10.1016/j.microrel.2008.03.022.
C.-f. Chen and P. C. Karulkar, “Underfill filler settling effect on the die backside interfacial stresses of flip chip packages,” ASME J. Electron. Packag., 130 (3), pp. 031005-1-10, 2008. doi:10.1115/1.2957324.
S. Guruzu, M. Kulkarni, S. Ingole, G. Xu, C.-f. Chen, H. Liang, “Friction induced crystalline phase on Si,” Wear, Vol. 259, pp. 524-528, 2005.
A. Wei, G. Nellis, A. Abdo, R. Engelstad, C.-f. Chen, M. Switkes, and M. Rotheschild, “Microfludic simulations for immersion lithography,” J. Microlithogr. Microfabrication, Microsyst., Vol.3, pp. 28-34, 2004.
P. Reu, C.-f. Chen, R. Engelstad, E. Lovell, M. Lercel, O. Wood, and S. Mackay, “Predicting overlay performance for electron-projection lithography mask,” J. Microlithogr. Microfabrication, Microsyst., Vol. 2, pp.148-156, 2003.
