The Reliability Lab is part of the Advanced Instrumentation Laboratory and home to the Dage X-ray inspection microscope.

Dage X-ray Microscope:

The Dage X-ray microscope offers a non-destructive way to examine and monitor the overall quality of solder joints. This becomes especially useful for in site investigation of area array packages such BGAs and flip chip devices where the leads become inaccessible and impossible to see after soldering them to the board. This instrument offers a way of imaging the connections without having to remove or destroy the component.